Technical capability

Capabilities

Five engineering disciplines, each covering the concrete work involved rather than a general description of it. How an engagement is structured on top of this — a single build, a standalone prototype, a handoff into production — is a separate question, covered on the services page.

By discipline

Hardware engineering

The physical board — schematic, layout and a fabricated, assembled prototype.

  • Schematic capture
  • Multi-layer PCB layout to 16 layers
  • Power electronics
  • Analog and digital circuit design
  • FPGA (Verilog/VHDL)
  • Enclosure and 3D design
  • In-house CNC prototype fabrication
  • Assembly, bring-up and test

Embedded Linux

The operating system layer, from board bring-up to the drivers and pipelines running above the kernel.

  • Board support package development
  • Kernel and driver work
  • Yocto/OpenEmbedded and PetaLinux
  • U-Boot, device trees and overlays
  • Boot-time reduction
  • Secure and encrypted boot, disk encryption
  • Audio pipelines (ALSA SoC, PulseAudio, PipeWire)
  • Camera and vision (V4L2, MIPI-CSI, GStreamer)

Firmware

Code that runs directly on a microcontroller, with or without an RTOS underneath it.

  • Bare-metal and RTOS
  • Microcontroller development (STM32, ESP32, ESP32-S3)
  • Real-time C++17
  • Safety-critical development written against MISRA-C/C++, with ISO 26262 and AUTOSAR alignment

Connectivity

How a device talks to other devices and to a network, at the protocol and stack level.

  • TCP/IP stacks for constrained devices
  • Mesh networking
  • Wi-Fi HaLow (802.11ah)
  • ZigBee (802.15.4)
  • AODV and OLSR routing
  • Cellular module integration
  • OpenWRT

Production and manufacturing support

The step between a working prototype and a batch of manufactured, provisioned boards.

  • Hardware validation suites
  • JTAG debugging and flashing
  • Encrypted flashing pipelines
  • EEPROM and SoC provisioning
  • Boot from SD, NAND and QSPI
  • CI-managed builds (GitLab)
  • DFM and fabrication file preparation

These capabilities can be engaged as a single end-to-end build, a standalone prototype, or a handoff into production.

See how we engage